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Titanium & titanium alloys - light, strong, corrosion-resistant

Reliable joining and finishing of titanium: Vacuum-brazing, EB welding, Heat treatment, LMD. Lightweight construction & biocompatibility for aerospace & medical technology.

Titanium - The most important facts in brief

Titanium offers the highest specific strength, biocompatibility and excellent corrosion resistance. Listemann optimizes titanium components through Heat treatment, Vacuum-brazing and EB welding – ideal for aerospace structures, medical components and high-purity vacuum applications.

Services & processes

  • Heat treatment for microstructure control (α/β proportion, toughness, strength)

  • Vacuum-brazing with active/intermetallic solders; dense, resilient joining zones

  • EB welding for deep, narrow seams with minimal thermal influence

  • LMD structure for repair and function integration (e.g. wear zones)

Typical applications

  • Lightweight structures, housings, stators/rotor components

  • Medical technology: biocompatible assemblies and instruments

  • Vacuum & semiconductor technology: low-particle, low-warpage joins

Listemann guaranteed

Oxygen-poor, bare surfaces

Precise geometry and gap control, high tightness

Process documentation for quality-critical applications

Titanium as a material - in which sectors?

Frequently asked questions about titanium

Stress relief annealing to reduce distortion, solution annealing + ageing (depending on the alloy) for microstructure control (α/β proportion, toughness, strength).

Active solders such as Ag-Cu-Ti, Cu-Sn-Ti or Au-Ni-Ti (depending on the required operating temperature, strength and medium). Ti-/Zr-activated systems can also be used for hybrids (Ti-ceramic/glass).

Vacuum processes with very low residual gas pressures, activated solders (e.g. containing Ti), surfaces strictly clean of grease and oxide (grinding/fine blasting, degreasing), narrow gap (typically 0.02-0.08 mm) and defined heating/holding time.

Titanium absorbs oxygen/nitrogen quickly; vacuum prevents alpha-case and provides bright, reactive surfaces for dense joins.

Uniform gap of ~0.02-0.08 mm, defined solder feed points, fixation against component migration; avoid sharp edges, provide run-on/run-off radii.

Depending on the solder system: Ag-Cu-Ti rather medium temperatures, Au-/Ni-based active solders higher continuous and peak temperatures – selection according to load spectrum & medium.

Stress-relief annealing, gentle heating/cooling ramps, symmetrical fixing, minimal heat input (EBW) and uniform solder distribution.

Pure titanium and many Ti alloys are biocompatible; clean surfaces, process-reliable joining zone geometry and validated cleaning are crucial.

Areas of application

Project check

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